Description
🔥 Master the art of BGA reballing with precision and speed!
- ALL IN ONE EFFICIENCY - Streamline your workflow with a 6-in-1 stencil kit supporting multiple BGA chip sizes.
- HEAT OPTIMIZED DESIGN - Special plump structure minimizes heat dissipation for flawless reballing every time.
- PRECISION ENGINEERING - Crafted from durable stainless steel with optimal mesh thickness for perfect solder placement.
- VERSATILE COMPATIBILITY - Supports a wide range of BGA sizes including 153, 162, 169, 186, 221, 254, and EMMC chips.
- COST EFFECTIVE RELIABILITY - Economical accessory that boosts your soldering accuracy and reduces rework time.
This 6-in-1 BGA reballing stencil kit features heat-resistant plump design and precision stainless steel mesh, compatible with multiple BGA chip sizes (153 to 254 and EMMC), delivering efficient, accurate, and economical soldering solutions.