Style:10 pcs Ultra-Flat Silicon Wafers Prime/CZ Virgin Grade; Orientation: <100>; Resistivity: 1-30 Ω; Type: P/Dopant: Boron; TIR < 3 μm, TTV < 10 μm, BOW < 10 μm, Roughness < 0.5 nm; Sizes Available: Six Inch 6'' Wafer with a Thickness of 650 µm +/- 20 µm; Four Inch 4'' Wafer with a Thickness of 525 µm +/- 20 µm; Three Inch 3'' Wafer with a Thickness of 400 µm +/- 20 µm;Two Inch 2'' Wafer with a Thickness of 300 µm +/- 15 µm; Formats Available: 1 Piece in a Wafer Carrier; 10 Pieces in a Wafer Box;25 Pieces in a Wafer Box; Wafer carriers or wafer boxes are included for every single purchase. We offer the ultra-flat silicon and silica wafers of the prime grade. These silicon and silica wafers are perfect for chemical deposition or cell growth while the 5mm x 5mm diced chips are ideal for direct AFM and SEM imaging. The silica substrates are silicon substrates uniformly coated with a 200 nm thermally grown SiO2 surface layer. Compared with the transitional chemical vapor deposition (CVD) method, the thermal oxidation provides a higher uniformity and a higher dielectric strength. Please visit https://www..com/dp/B07C1KPC92 for our listings for silica wafers.For more information, please visit us at www.alphananotechne.comor send us your questions to [email protected] ask questions directly on the "Have a question?" tab above.
Trustpilot
2 months ago
1 month ago